Join us at the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES).
The through-plane thermal conductivity of many components of a fuel cell, dry NafionĀ®, various diffusion medias and catalyst layers are studied. The thermal contact resistance between the diffusion media and a metal plate with respect to temperature and pressure was also determined. The measurements were made with a guarded heat flow meter device. The least accurate measurement was of the Toray carbon ...
Porous epoxy thermosets were prepared using poly(ethylene glycol) (PEG) as a template. The two epoxies that were used to make the porous thermosets were diglycidylether bisphenol-A (DGEBA), and triphenylolmethane triglycidyl ether (TGTPM). Trimethylolpropane tris(poly(propylene glycol)), amine terminated)ether (T-403) was used as a hardener in producing the thermosets. The porous thermosets were then characterized to determine their structural, thermal, optical, dielectric, and mechanical properties, and the results ...
Synthetic polymers in starch-based polymer formulations improve the thermal and mechanical properties of the compounds. The purpose of this study was to develop and analyze foams containing ethylene-vinyl acetate (EVA) and varying concentrations of corn starch. A Thermal Constants Analyser measured the thermal conductivity of the EVA/starch samples using the transient plane source (TPS) method. Results showed that the thermal conductivity of the blends increased with starch content. The ...
The authors highlight different methods of studying the purity, composition, and structural changes of polymeric and glass materials. These methods include the use of differential scanning calorimetry (DSC) and the transient plane source (TPS) technique. The quality of the TPS Technique is outlined and the authors praise the high quality of the machine. In addition to this, thermal analysis is carried out on some polymeric composites (cis-polyisoprene (CPI)/trans-polyisoprene (TPI) ...
The researchers proposed a method used to measure the thermal conductivity and heat capacity of low thermal conductivity materials with accuracy better than 10%. DSC was also used to determine thermal contact between the sample and the DSC furnace....
