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Thermal properties and moisture absorption of nanofillers-filled epoxy composite thin film for electronic application

The effects of the addition of three different fillers to a polymer matrix on the thermo-physical properties of the resulting composites were investigated by the authors. Boron nitride, synthetic diamond, and silicon nitride were used as the fillers (up to 2 vol. %), and it was found that their addition did increase the thermal conductivity relative to that of the pure epoxy matrix. Furthermore, it was determined that the thermal conductivities of the composites increased with increasing filler content, and the maximum thermal conductivity observed in the composites prepared in this work was 78 % higher than that of the pure epoxy matrix. The synthetic diamond filled composites were found to be more thermally stable than the other two types of composites; however, they were found to absorb more moisture than the other composites.

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Thermal Composites of Biobased Polyamide with Boron Nitride Micro Networks

In this paper, polyamide (PA, composed of at least 60% renewable materials) was used as a polymer matrix to prepare PA-hexagonal boron nitride (hBN) polymer composites with varying hBN contents. Two different PA samples were used in this study: a low viscosity grade PA (PA-30), as well as a high viscosity grade PA (PA-90). The composite polymers were tested to evaluate their thermal, physical, and mechanical properties. It was concluded that these composites had more favourable properties than other polymers that had been previously tested, and so the composites would be a good choice as an electronic packaging material.

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