Join us at the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES).
May 3, 2024
July 7, 2022
June 24, 2022
January 24, 2022
October 28, 2021
July 8, 2019
September 22, 2017
November 26, 2018
June 9, 2017
September 27, 2017
July 24, 2017
September 22, 2017
September 27, 2017
November 26, 2018
January 30, 2019
25th International Thermal Conductivity Conference Award Co-Winner 1999
Graduating with a Doctor of Science degree from the University of Tokyo, Dr. Tetsuya Baba specializes in the standards and metrology of thin film thermophysical properties and the development of a thermophysical properties database. As an emeritus researcher at the National Institute of Advanced Industrial Science and Technology and the senior researcher of TherMAT, Baba has contributed more than 100 scientific publications and is an active speaker at various thermophysical conferences. In addition to his career, he is a member of the International Committee for Weights and Measures, and Chairman of Working Group 9 and the Japan Society of Thermophysical Properties.
Proceedings of the Twenty-Fifth International Thermal Conductivity Conference, 25th, Uher, C., Morelli, D. (2000). Thermal Conductivity 25. Texas: CRC Press.