Join us at the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES).

Ronald P. Tye

15th International Thermal Conductivity Conference Award Co-Winner 1977

As a founder of the internationally recognized laboratory, Dynatech, Ronald P. Tye was instrumental in establishing and marketing the latest thermal technology. An expert in the field of thermal properties and materials testing, Tye is the author and co-author of seven books, over 150 research papers, and has more than 700 citations. He is also a member of the International Organization for Standardization (ISO) and ASTM International, where he is actively involved in developing international standards for a wide range of materials, products, systems, and services. Ron Tye was the recipient of the ASTM International Award of Merit and the ASTM International Honors Award, and later received the ASTM International Award of Appreciation in 2000. With a career of dedication and contribution to the scientific community, Tye was awarded the ECTP Lifetime Award in 2005, to honour his outstanding scientific research on thermophysical properties.


Published Proceedings of the 15th ITCC:

International Conference on Thermal Conductivity, 15th, Mirkovich, V. V. (1978). Thermal conductivity 15. New York: Plenum Press.


Most Cited Works by Ron P. Tye:

    Hume, D., Tye, R.P. 2017. Reference Materials for Thermal Transport Properties. Journal of Thermal Analysis and Calorimetry, 1-11.
    Salmon, D., Tye, R.P. 2010. An inter-comparison of a steady-state and transient methods for measuring the thermal conductivity of thin specimens of masonry materials. Journal of Building Physics, 34(3): 247-261.
    Kubicar, L., Lockmuller, N., Tye, R.P. 2005. The development of a standard for contact transient methods of measurement of thermophysical properties. International Journal of Thermophysics, 26(6): 1917-1938.

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