Category: Transient Plane Source
Author(s): A. V. K. Westwood, C. Stirling, M. A. Raza, N. Hondow
Keywords: composites, Electrical Conductivity, Fillers, Mechanical stirring, Scanning Electron Microscopy (SEM), Silicone, Strain, strength, Thermal Conductivity, Transient plane source (TPS), Transient plane source (TPS) method, Uniformity, Vapor grown carbon nanofiber (VGCNF)
Abstract: Silicone materials have high electrical and thermal insulation properties that are useful for engineering applications. In this study, vapour grown carbon nanofibers (VGCNF) were produced by two different methods and were added to silicone rubber to improve conductivity. A thermal constant analyser measured the thermal conductivities of the silicone and its composites using the transient plane source (TPS) method. Results showed that thermal conductivities of the roll-mill produced VGCNF/silicone composites were higher than those produced by mechanical mixing. The thermal conductivity enhancements of the rubber composites observed in this experiment were higher than any other study thus far, and were achieved at lower loadings. However, they were still lower than those of commercial thermal interface materials.
Reference: Composites Part A: Applied Science and Manufacturing, 42, 10 (2011) 1335-1343