Category: Transient Plane Source
Author(s): Andrey Sizov, Arne RosC)n, Daniel Cederkrantz, L. Jacobson, L. Salmi
Keywords: Computer modeling, depth profiling, Heat Capacity, homogenous materials, inhomogenous materials, Materials analysis, Surface conductivity, Thermal Conductivity, TPS
Abstract: This research highlights the capabilities of transient measurements and sensors to estimate thermal conductivities of samples with large voids/variations in their compositions. Because of the lack of a physical model to predict thermal conductivity vs depth information of inhomogenous materials, researchers have utilized existing models to create an advanced iteration scheme, to determine depth position data. Although the authors have discovered a promising and reproducible means to determine the thermal conductivity of inhomogenous materials, they have noted this method may not be an accurate thermal depth-profiling tool, but should be regarded as a non-destructive, structural gradient analysis method.
Reference: Review of Scientific Instruments 87, 074901 (2016)
DOI: 10.1063/1.4954972