Category: Transient Plane Source
Abstract: Adding thermally conductive fillers into flexible moulds has been proven to decrease the solidification time of the polymers. The aim of this study was to determine the thermal conductivity, thermal diffusivity, and specific heat of the flexible moulds polyurethane (PU) and silicone rubber (SR) after the addition of aluminum and graphite. Thermal properties were measured using the transient plane source (TPS) hot disk method. Results showed that the thermal conductivities of particulate filled PU and SR increased by about ten-fold. It was also found that the graphite additives were more thermally conductive than the aluminum particles. Knowing the thermal conductivity values of the fillers will continue to minimize the cooling time of flexible moulds in the future.
Reference: WIT Transactions on The Built Environment, 112 (2010) 365 - 376