Join us at the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES).

Thermal Conductivity Paper Database

Search academic papers below:

Recommended Papers for: Soft Tooling Process

Total Papers Found: 3

Experimental investigation on equivalent properties of particle reinforced silicone rubber: Improvement of soft tooling process

Soft tooling processes use flexible polymeric materials to manufacture moulds. However, the malleable materials used for soft tooling, such as silicone rubber, have low thermal conductivities and take an extensive amount of time to cool. In this study, metallic (Aluminum fine powder, grey iron, copper, magnesium, titanium, zinc) and non-metallic (graphite, silicone, glass) thermally conductive filler particles were added to silicone rubber to condense the cooling time of soft tooling ...

Author(s): , , ,

Experimental studies on equivalent thermal properties of particle reinforced flexible mould materials

Adding thermally conductive fillers into flexible moulds has been proven to decrease the solidification time of the polymers. The aim of this study was to determine the thermal conductivity, thermal diffusivity, and specific heat of the flexible moulds polyurethane (PU) and silicone rubber (SR) after the addition of aluminum and graphite. Thermal properties were measured using the transient plane source (TPS) method. Results showed that the thermal conductivities of particulate ...

Author(s): , ,

Improvement of Soft Tooling Process Through Particle Reinforcement with Polyurethane Mould

In the soft tooling process for making moulds, polyurethane is often used as a flexible mould material. The low thermal conductivity of polyurethane results in a long solidification time of the wax/plastic pattern produced in the soft tooling process. In an effort to address this issue, the authors of this article have added highly conductive fillers to polyurethane. The fillers used for this study were aluminum fine powder and ...

Author(s): ,