Category: Transient Plane Source
Keywords: Acoustic Insulation, characterization, foam injection molding, foam injection molding (FIM), lightweight, mechanical properties, open celled, polycarbonate (PC) foams, rigid, Solids, sound insulation, Thermal Conductivity, thermal insulation, Transient plane source (TPS), Transient plane source (TPS) method
Abstract: This study was conducted to determine if highly expanded open cell polycarbonate foams (PC) could be used as thermal insulation among other characteristics of the foam. This was accomplished through testing the PC foam with the Hot Disk Transient Plane Source (TPS) method. Multiple relative densities of foam were tested, and it was found that the higher the relative density the higher the thermal conductivity, and vice versa. The lower the relative density means that there is a larger open cell content which led to the thermal conductivity being decreased fivefold.
Reference: Macromolecular Materials and Engineering, 300, 1 (2014) 48-56