As technology advances, the need for inexpensive polymer-based composites possessing high thermal conductive properties has become more and more important. Previously, the addition of thermal conductive particles, such as alumina, boron nitride and alumina nitride, has caused an increase in the thermal conductivity of the composite. Although an increase in thermal conductivity is present, an increase in fabrication costs is also experienced as a higher quantity of particles is required, in order to achieve the higher thermal conductivity readings. For this experiment, researchers set out to test the thermal conductivity of composites containing functionalized graphene nanosheets (GNSs), using the transient plane source method. As a result of the rigorous thermal conductivity testing performed, a non-destructive approach at increasing the thermal conductivity of GNS-filled epoxy composites was identified.
This study primarily focuses on the electrical and thermal conductivity of nanoparticle filled epoxy resins. Modification of polymers on a nanstructure level has revealed a new world of possibilities for multi-functional materials. Research has found that carbon nanotubes may have the potential to improve mechanical performance of conductive polymers. This research studies the thermal performance of the resins with respect to various types of carbon nanotubes, various concentrations of filler contents and varying surface areas.
The objective of this study was to create polymer composites with high thermal conductivity and mechanical properties. To acquire these, aluminum nitride microparticles were modified with a titanate coupling reagent of isopropyltrioleictitanate, and blended via a power-mixing method into linear low-density polyethylene. Using a thermal constants analyzer, the thermal conductivity of the composite was measured. The results concluded that the addition of aluminum nitride particles to the composite enhanced the thermal conductivity, as well as mechanical properties significantly.
During a melt blending process, carbon nanotubes (CNTs) were added to a poly(vinylidene fluoride)/Boron nitride (PVDF/BN) composite, to increase the thermal conductivity of this polymer composite, for uses in the electronic industry. After this process, the thermal and electrical conductivities, along with any microstructure changes were investigated. It was determined that with the addition of CNTs, the thermal conductivity rating of the composite increased, as well as its crystallinity. Also, as CNTs are added to the composite, BN is dispersed homogeneously within the composite and it does not hinder the adhesion of BN/PVDF. It was also noted that the lower the BN content, the higher the dielectric constant, and therefore a lower amount of dielectric loss occurs. Based on the results received, the PVDF/BN/CNT composite may potentially be used in the electronic industry as a heat conductor.
The need for higher thermal conductivity fillers, such as aluminum nitride, to deal with an increase in the heat output from future semiconductors has arisen, as most of them are now packaged in a silica epoxy polymer composite. Thermal conductivity testing was performed on the aluminum nitride composite using a thermal constants analyzer and the highest reading was 3.39 W/mK, approximately 15 times higher than pure epoxy. Based on the results, the potential replacement of silica epoxy composites, with aluminum nitride composite to encapsulate circuit chips is highly plausible.