Various microfibrillar composites were prepared in situ using boron nitride as a thermally conductive filler. The multistage stretching extrusion process was used in an effort to improve thermal conductivity and mechanical properties. It was found that the addition of laminating-multiplying elements (LMEs) improved the dispersion of BN in the composite polymers and they also improved the tensile and impact strength of the polymers. It was also found that the thermal conductivity was increased when this method was used and that the thermal conductivity could be calculated based on filler and LME content by modifying a previously determined equation.
Polyether Ether Ketone (PEEK)/hexagonal boron nitride (h-BN) nanocomposites were formed by a planetary ball milling process and hot compression molding in order to determine the effect of the addition of h-BN on the properties of PEEK. In particular, the tensile strength, friction and wear behaviors, morphology, hardness, thermomechanical properties, and thermal conductivity of the nanocomposite were examined. Hexagonal boron nitride was added in filler concentrations of up to 5 wt. %. It was found that the PEEK/h-BN nanocomposites showed improvements in all of the properties examined when compared to those of PEEK composites, and so it was concluded that PEEK/h-BN shows promise as a nanocomposite polymer for a large variety of applications.
The development of environmentally sustainable materials for use in the management of heat in electronics is becoming increasingly important. Currently the majority of materials that are used for this purpose are oil-based. In this article, the thermal transport, physical, electrical, and mechanical properties of a bio-based polymer matrix (polyactic acid) with embedded hexagonal boron nitride were studied to determine if this would be a practical material for use in the electronics industry.
The authors highlight different methods of studying the purity, composition, and structural changes of polymeric and glass materials. These methods include the use of differential scanning calorimetry (DSC) and the Transient Plane Source, TPS technique. The quality of the TPS Technique is outlined and the authors praise the high quality of the machine. In addition to this, thermal analysis is carried out on some polymeric composites (cis-polyisoprene (CPI)/trans-polyisoprene (TPI) and polystyrene (PS)/polymethyl methacrylate (PMMA)) using dynamic mechanical analysis and by the TPS technique.