In this study, variations of thermal properties that depend on the injection molding technique were analyzed. Thermal conductivity was measured using a two-sided a transient plane source method. Results indicate that polytetrafluoroethylene (PTFE) is the most significant raw material on short glass fiber (SGF) and PTFE- reinforced polycarbonate (PC) composites for thermal conductivity. This approach can effectively help in determining the optimal mixture ratio settings for reinforcement under multi-response consideration....
In this study, the effect of freeze casting method to fabricate thermal insulators is analyzed. Gelation freezing was done to create unique honeycomb-like microstructures with high porosity. A thermal analyzer was used to measure the thermal conductivity of the insulators with the transient plane source (TPS) method. Results showed that the insulators exhibited very low thermal conductivities....
In this study, effective thermal conductivity of nanocomposites containing thermally conductive aluminum nitride (AIN) nanoparticles reinforced with high-density polyethylene (HDPE) was investigated. Measurements were performed using a Thermal Constant Analyzer. The authors found that effective thermal conductivity of HDPE/AIN composites with 20 vol.% of AIN nanoparticles shows an enhancement by about 40%, compared to pure HDPE at 30°C....
This article investigated the effects of incorporating highly-conductive silver nanoparticles into eicosane-based phase change materials. The influence of silver nanoparticles on the thermal conductivity of the material was compared under three different solidification techniques. A Thermal Constants Analyzer measured the thermal conductivities of the samples using the transient plane source (TPS) method. The authors found that thermal conductivity increased as temperature increased, and that there was a sharp rise in ...
Mechanical flexibility, low cost, and lightweight design are crucial elements for high demand electronic devices and has increased the application of flexible printed circuit board (FPCB). However, FPCB exhibits stress under operating conditions compared to rigid printed circuit board (RPCB), and was studied to investigate the effects of airflow rate and heat on FPCB attached with a ball grid array (BGA) package. Thermal conductivity and specific heat were measured using ...
