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Recommended Papers for: Thermal Conductivity Measurement

Total Papers Found: 10

Measurements of thermal conductivity of solid eicosane-based NePCM

This paper aimed to measure the thermal conductivity of pure eicosane, eicosane-CuO and eicosane-MWCNTs solid composites. A Thermal Constants Analyzer measured the thermal conductivity of the nanostructure-enhanced PCMs using the transient plane source (TPS) method. Results showed that the thermal conductivity increased rapidly as the temperature of the solid composites approached the melting point. Additionally, the samples that were solidified in an oven, and the eicosane-MWCNT samples experienced the largest ...


Thermal property measurement and heat storage analysis of LiNO3/KCl – expanded graphite composite phase change material

A novel composite phase change material (PCM) composed of LiNO3/KCl with expanded graphite (EG) as a filler was prepared and investigated to determine if it had potential for use in solar energy storage applications. The addition of the expanded graphite did not significantly alter the melting temperature in comparison with the eutectic LiNO3/KCl PCM; however, the latent heat of fusion did significantly decrease with increasing mass fractions of ...

Author(s): , , , ,

Finite element modeling of the TPS method

This paper aimed to develop a 3D simulation based on the TPS technique that analyzed the spiral geometry and properties of the sample material and TPS sensor. A numerical study was simulated to reproduce the transient curve generated by the experimental study. Results of the experiment showed that the temperature of the central rings in the sensor were higher than the peripheral rings. The numerical and experimental results were compared ...

Author(s): , , , ,

Reinforced thermal conductivity and mechanical properties of in situ microfibrillar composites through multistage stretching extrusion

Various microfibrillar composites were prepared in situ using boron nitride as a thermally conductive filler. The multistage stretching extrusion process was used in an effort to improve thermal conductivity and mechanical properties. It was found that the addition of laminating-multiplying elements (LMEs) improved the dispersion of BN in the composite polymers and they also improved the tensile and impact strength of the polymers. It was also found that the thermal ...

Author(s): , , ,

Thermal Conductivity of Nitrogenated Ultrananocrystalline Diamond films on Silicon

Thermal conductivity testing was done on nitrogenated ultrananocrystalline diamond films on silicon. Temperature dependence on thermal conductivity was measured using these two techniques. A decrease in thermal conductivity was observed with the introduction of nitrogen addition. It was observed that MCD had the highest thermal conductivity followed by UNCD at 25% nitrogen and UNCD at 0% nitrogen....

Author(s): , , , , ,