A novel replication technique for the fabrication of 3D microstructures was developed. A polished silicon wafer was transferred onto an epoxy composite. The thermal properties of the epoxy composite were investigated and compared to those of the pure epoxy. It was determined that not only was the thermal conductivity increased, but the epoxy composite also showed an improvement in mechanical properties over the pure epoxy....
This research studied the addition of aluminum particles to an epoxy material, for use in micro-scale structures. For our interests, the thermal conductivity of the aluminum-epoxy composite was compared to that of the epoxy alone. Particle size was also taken into consideration during testing. It was determined that the epoxy-aluminum composite has a higher thermal conductivity, than the epoxy alone. Also noted, the larger the particle size, the more thermally ...
