The Transient Plane Source method was used in this research article to measure the thermal conductivity of an Ionanofluid, highly stable graphene (GE)-based nanofluid, at various temperatures. Researchers took special note of the effects of temperature, GE loading, presence of multi-walled carbon nanotubes (MWCNTs), on the thermal conductivity of the nanofluid. Through experimental testing, it was determined that the nanofluid elicited a higher thermal conductivity, as compared to its ...
Author(s): F. Wang, J. Shi, L. Han, W. Ma, X. Fang, Z. Zhang
In this paper, researchers investigated the effects of multi-walled carbon nanotubes (MWNTs), on the thermal conductivity and phase change enthalpy of palmitic acid (PA), a solid to liquid phase change material. The research concluded that as the concentration of MWNTs is increased, the thermal conductivity of the composite increases, compared to that of PA alone. Also in this study, researchers investigated the effects of various MWNTs surface modifications, on the ...
Author(s): D. W. Yang, F. Xu, J. L. Zeng, L. X. SUn, L. Zhang, X. F. Zhang, Z. Cao
Many limitations exist within the development of energy efficient heat transfer fluids; however, low thermal conductivity of these fluids is the main issue. In order to improve the thermal conductivity of these heat transfer fluids, researchers in this study performed strenuous research and ultimately created a new and improved fluid. In this newly designed material, nanoparticles and carbon-nanotubes (CNTs) were suspended within the fluid, aiming to increase the fluids thermal ...
Author(s): F. D. S. Marquis, L. P. F. Chibante
Researchers have determined the potential of increasing the thermal conductivity of insulating polymers by adding conductive fillers. One common application this may be used for, is fuel cell bipolar plates. In this article, researchers tested varying amounts of three different carbon fillers (black carbon, synthetic graphite particles, and carbon nanotubes), by adding them to polypropylene. Both single fillers and combination fillers were studied for their potential effects on the thermal ...
Author(s): B. A. Johnson, C. J. Ciarkowski, J. A. King, M. D. Via
Thermal Interface Materials (TIMs) are used in the field of electronics, to reduce the thermal contact resistance between the heat sink and heat source, to improve heat dissipation within the electronic device. In this experiment, researchers created a TIM by synthesizing Carbon Nano-Tubes (CNTs) on both sides of a thin copper foil. To test the thermal conductivity of the foil with this enhancement, the transient plane source method was employed. ...
Author(s): H. Wang, J. Y. Feng, K. M. Ng, X. J. Hu
