Author(s): , , , , , , ,

Keywords: , , , , , , , , ,

Abstract: The Transient Plane Source Method is a helpful tool to test for the thermal conductivity of homogenous materials, however researchers at both the Chalmers University of Technology and Gothenberg University have created a process to test the thermal conductivities of inhomogeneous materials. For this experiment, a thermal analyzer was used to determine the thermal conductivities of four different sample materials (polymers and Pyrex glass) – each with different sizes and defects. Through the thermal conductivity testing, researchers determined that a change in thermal conductivity values dictates a change in the physical make-up of the sample, meaning as the thermal conductivity trend changes with depth, a defect can be assumed at that depth. A hidden void is generally depicted as a sudden dip in thermal conductivity, followed by an increase. The ability of multiple sensor sizes to detect voids was also tested. This research concluded that as the sensor is positioned at a further distance from the defect, the sensitivity of detection decreases.

Reference: AIP Advances 6, 085217 (2016)

DOI: 10.1063/1.4961879