This research article delves into the thermal conductivity monitoring of open-cell foams. The foams are created through an intense procedure, in which slip reaction foam sintering is employed. Prior to measuring the thermal conductivities of the foams, a multiscale approach, taking into consideration the homogenization method, was used to predict thermal conductivity values. To obtain experimental results, the Transient Plane Source method was then used to determine the thermal conductivity ...
Thermal Interface Materials (TIMs) are used in the field of electronics, to reduce the thermal contact resistance between the heat sink and heat source, to improve heat dissipation within the electronic device. In this experiment, researchers created a TIM by synthesizing Carbon Nano-Tubes (CNTs) on both sides of a thin copper foil. To test the thermal conductivity of the foil with this enhancement, the transient plane source method was employed. ...
