Join us at the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES).

Thermal Conductivity Paper Database

Search academic papers below:

Recommended Papers for: Building equipment control

Total Papers Found: 1

Thermal design of a sensor for building control equipped with QFN electronic devices subjected to free convection. Effects of the encapsulating resin

Quad Flat Non-Lead (QFN) devices are sensors used in building designs to control electronic equipment. The temperature of the QFN sometimes exceeds its maximum threshold, which this is primarily due to the encapsulating resin. In this study, the thermal conductivity of the resin was tested for the QFN16b, QFN32b, and QFN64b using the Transient Plane Source (TPS). Power levels between 0.1 W and 1.0 W were administered through the ...

Author(s): , , , ,