Design, Assembly and Commisioning of a Test Apparatus for Characterizing Thermal Interface Materials
Author(s): I. Savija, J. R. Culham, M. M. Yovanovich, P. Teertstra
Thermal interface materials (TIMs) are often used in electronic and microelectronic applications. It can be difficult to determine their characteristics once they are in-situ because it is hard to account ...
Keywords: Contact resistance, electronics, GHF, in-situ thickness measurement, metallic foils, phase change materials, Polymeric materials, test apparatus, Thermal Conductivity, thermal interface materials
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