Join us at the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES).
The aim of this study was to fabricate transparent polymers with high thermal conductivities for applications in electronic packaging. Characteristics of the inorganic filler, calcium fluoride (CaF2), and the polymer matrix were examined, and thermal conductivity was measured using a thermal analyzer based on the transient plane source (TPS) method. Results showed that the thermal conductivity of the composites increased with CaF2 content. This study was the first to report ...
Thermal Interface Materials (TIMs) are used in the field of electronics, to reduce the thermal contact resistance between the heat sink and heat source, to improve heat dissipation within the electronic device. In this experiment, researchers created a TIM by synthesizing Carbon Nano-Tubes (CNTs) on both sides of a thin copper foil. To test the thermal conductivity of the foil with this enhancement, the transient plane source method was employed. ...
