Join us at the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES).
The development of higher power chips in the electronics industry has led to the requirement of high performance thermal interface materials (TIMs) due to the increased heat output by these chips. Desirable features of a high performance TIM include that the material be highly thermally conductive, and that it should have a relatively low viscosity. Companies can spend long periods of time trying to find the amount of filler content ...
