Mathematical Methods for the Rapid Development of New High Performance Thermal Interface Materials
Author(s): Kathleen A. Gilbert, Nicolas D. Huffman, Sara N. Paisner, Timothy D. Fornes
The development of higher power chips in the electronics industry has led to the requirement of high performance thermal interface materials (TIMs) due to the increased heat output by these ...
Keywords: C-Mode Scanning Acoustic Microscope, Fillers, Humidity Testing, JESD22-A102-C Accelerated Moisture Resistance Test Method, Laser Flash LFA 447 NanoFlash Apparatus, Stencil Printability, Thermal Adhesives, Thermal Conductivity, Thermal Diffusivity, Thermal Gels, Thermal Greases, thermal interface materials, TIMs, Transient Plane Source Technique, X-Ray
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