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Recommended Papers for: Ai Du

Total Papers Found: 3

Effect of the thermal treatment on microstructure and physical properties of low-density and high transparency silica aerogels via acetonitrile supercritical drying

Silica aerogels have extremely low thermal conductivities, potentially making them effective thermal insulators. In this study, the thermal conductivities of various samples were explored using the Transient Plane Source (TPS) Method. Samples of the silica aerogels were approximately 1.3 cm thick and between 4.1-4.3 cm in diameter, and were tested at different temperatures. Results showed that as the temperature of the samples increased from 25-50 °C, thermal conductivity increased exponentially. As ...

Author(s): , , , ,

Influence of thermal process on microstructural and physical properties of ambient pressure dried hydrophobic silica aerogel monoliths

Ambient pressure dried hydrophobic silica aerogel monoliths were prepared via simultaneous solvent exchange and surface modification in order to minimize volume shrinkage and density. At room temperature, the obtained silica aerogels had a low density of 0.096 g/cm3, a high surface area and hydrophobicity, and a low thermal conductivity of 0.0217 W/m·K. The effect of heating on these properties was also determined. After the aerogel had been heated to 300...

Author(s): , , , , , , ,

One-pot synthesis, characterization and properties of acid-catalyzed resorcinol/formaldehyde cross-linked silica aerogels and their conversion to hierarchical porous carbon monoliths

Aerogels are ultra-light, insulative, porous materials that have a wide variety of applications. The aim of this study was to synthesize resorcinol/formaldehyde (RF) cross-linked silica aerogels in one pot by acid catalysis. A thermal constant analyzer measured the thermal conductivity of the RF/SiO2 aerogels using the transient plane source (TPS) method. Results showed that although the RF/SiO2 aerogels had a lower density, their thermal conductivities resembled those ...

Author(s): , , , , , , ,