Join us at the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES).
Resin polymers, such as Polymethyl methacrylate (PMMA), have been used in denture fabrication because of their easy molding ability and flawless appearance. However, these PMMAs are not the most desirable material when dealing with mechanical strength, electrical conductivity and thermal stability. In this study, the addition of fillers, such as Nano-Aluminum Oxide (Nano-Al2O3) and plasma treated polypropylene (PP) fibers, to these polymers has been explored. Nanocomposites are desired in ...
Multi walled carbon nanotubes (MWCNTs) and carbonized resorcinol-formaldehyde (RF) resin were used to create a conducting aerogel with a high electrical conductivity and Seebeck coefficient but a low thermal conductivity. The addition of the MWCNTs caused the figure of merit (ZT) for the aerogel to increase by two orders of magnitude. The researchers determined that it was possibly to control the electrical conductivity, thermal conductivity, and Seebeck coefficient independently of ...
Phenolic resin impregnation was combined with liquid silicon infiltration to create a carbon/silicon carbide composite. The potential application for this material is in disc brakes in vehicles due to their oxidation resistance and friction behaviour. The density of the composite was altered until a final value of 2.10g/cm3 was achieved. The thermal conductivity of the composite was measured using the TPS method, and was determined to be 48.72 W/...
Diamond powders with various particle sizes were dispersed in an epoxy resin in an effort to increase its thermal conductivity. Dispersion of a mixture of particle sizes from 1 to 100 µm resulted in a thermal conductivity of 4.1 W/m·K which is a substantial increase in comparison to the thermal conductivity of the pure epoxy. The electronic device junction temperature between a Si PiN diode chip and a 64 vol. % diamond-epoxy flowable ...
