Thermal Conductivity Paper Database He

Dr. Yi He

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Dr. Yi He is most recently known for his extensive research on the thermal characterization of electronic packaging materials, for Intel. He graduated from Sichuan University with a BSc in Solid State Physics in 1984 and then went on to earn his MSc in Physics in 1987, at the University of Waterloo. Dr. He received his PhD in Physics from the University of Virginia in 1993, where He, along with some other colleagues were the first to discover aluminum-based amorphous alloys. He then moved on to do Post-Doctoral Research at the Center for Materials Science at Los Alamos University for three years, where he continued his studies on quasicrystalline alloys and metallic glasses. He has had a wide array of research focuses, from studying the alpha particle emissivity of packaging materials for support in soft error rate modeling of electronic devices, to performing resonant ultrasound spectroscopy characterization of elastic constants of intermetallic compounds and bulk amorphous alloys. Over the years, He has published over 90 papers and has over 2600 citations. Currently, He holds a position at Intel as a Senior Staff Engineer, where he focuses his research efforts on the thermal expansion, viscoelastic properties of underfills, electronic molding compounds, and substrate related material, to improve the materials used in electronic packaging.

 

Most Cited Thermal Conductivity Works:

 

Selection of Work by Dr. Yi He

Synthesis and properties of metallic glasses that contain aluminum
Science, 241(4873): 1640 (1998)
Y. He, S. J. Poon, and G. J. Shiflet
Bulk glass formation in the Pd–Ni–P system
Applied physics letters 69(13): 1861-1863 (1996)
Y. He, R. B. Schwarz, and J. I. Archuleta
Atomic structure of amorphous Al90 Fex Ce10− x
Journal of Materials Research, 5(12): 2807-2812 (1990)
H. Y. Hsieh, B. H. Toby, T. Egami, Y. He, S. J. Poon, and G. J. Shiflet
Mechanical properties of a new class of metallic glasses based on aluminum
Journal of Applied Physics, 64(12): 6863-6865 (1998)
G. J. Shiflet, Y. He, and S. J. Poon
Deformation-induced nanocrystal formation in shear bands of amorphous alloys
Nature, 367(6463): 541-543 (1994)
H. Chen, Y. He, G. J. Shiflet, and S. J. Poon
Ball milling-induced nanocrystal formation in aluminum-based metallic glasses
Acta Metallurgica et Materialia 43(1): (1995)
Y. He, G. J. Shiflet, and S. J. Poon
Thermal characterization of an epoxy-based underfill material for flip chip packaging
Thermochimica Acta, 357(14): 1 – 8 (2000)
Y. He, B. E. Moreira, A. Overson and J. F. Briscoe
Bulk amorphous metallic alloys: Synthesis by fluxing techniques and properties
Metallurgical and Materials Transactions A, 29(7): 1795 – 1804(1998)
Y. He, T. D. Shen, and R. B Schwarz
DSC and DEA studies of underfill curing kinetics
Thermochimica Acta, 367: 101 – 106 (2001)
Y. He
In-situ Characterization of Moisture Absorption and Desorption in a Thin BT Core Substrate
Proceedings – Electronic Components and Technology Conference, (2007)
Y. He and X. Fan