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Thermal Conductivity Paper Database

Thermtest has compiled the world’s largest thermal conductivity academic paper database. The research paper database is dedicated to the Transient Plane Source (TPS), Transient Hot Wire (THW), Transient Line Source (TLS), and Guarded Heat Flow Meter (GHFM). These techniques offer a wide range of applications, which is represented by more than 1000 papers represented in the database! Search academic papers below:

Recommended Papers for: silicone

Total Papers Found: 16

Experimental investigation on equivalent properties of particle reinforced silicone rubber: Improvement of soft tooling process

Soft tooling processes use flexible polymeric materials to manufacture moulds. However, the malleable materials used for soft tooling, such as silicone rubber, have low thermal conductivities and take an extensive amount of time to cool. In this study, metallic (Aluminum fine powder, grey iron, copper, magnesium, titanium, zinc) and non-metallic (graphite, silicone, glass) thermally conductive filler particles were added to silicone rubber to condense the cooling time of soft tooling ...

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Experimental studies on equivalent thermal properties of particle reinforced flexible mould materials

Adding thermally conductive fillers into flexible moulds has been proven to decrease the solidification time of the polymers. The aim of this study was to determine the thermal conductivity, thermal diffusivity, and specific heat of the flexible moulds polyurethane (PU) and silicone rubber (SR) after the addition of aluminum and graphite. Thermal properties were measured using the transient plane source (TPS) method. Results showed that the thermal conductivities of particulate ...

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Effect of nanosized carbon black on the morphology, transport, and mechanical properties of rubbery epoxy and silicone composites

Rubber carbon black (CB)/rubbery epoxy (RE) and CB/silicone composites with different types, loadings, and silane functionalization of carbon black were prepared. These composites were investigated for their electrical conductivities, and their mechanical properties. The thermal conductivity of each composite was also determined using a thermal constants analyzer. It was determined that the incorporation of carbon black into the composites increased the thermal conductivity in all of the samples. ...

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Optimization of cooling time for measuring Thermal properties of electronic materials using the transient plane source technique

The effects of cooling time on the reproducibility and accuracy of thermal conductivity measurements made using a Thermal Constants Analyzer were evaluated. Selected metal alloys and silicone based electronic interface materials were used for the testing. Cooling times of 30, 15, 10, 5, and 1 minute between measurements were selected, and three measurements were made for each cooling time. These tests were also performed at temperatures of 25, 50, and 70ºC to determine if sample temperature had ...

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Graphite nanoplatelet/silicone composites for thermal interface applications

Graphite nanoplatelets were dispersed in varying quantities into a silicone matrix to form composite materials with higher thermal conductivities than the pure silicone matrix without sacrificing mechanical properties. It was found that the thermal conductivities of the composites increased with increasing GNP content as well as with increasing GNP particle size. The composites were found to be effectively electrically insulating, and it was found that the addition of GNP did ...

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