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Safety tests were conducted on cesium-loaded spherical resorcinol formaldehyde (SRF), resulting in a possible reclassification of the fire safety for the Cesium Ion Exchange Process System (CXP) emergency elution vessels, equipment, and piping. One of these tests was to determine the thermal conductivity using the transient line source technique, as thermal conductivity is a very important quantity for the safe treatment of materials....
The transient plane source (TPS) method was used to measure the thermal conductivity of two hermetic edge-sealing materials by using the Thermal Constants Analyser. Two materials were studied, the Cerasolzer CS186 alloy and the J-B Weld epoxy-steel resin. They were measured, and the TPS technique was validated by obtaining the thermal conductivity values of mild-steel and indium and comparing them to the available literature values. The thermal conductivity was measured ...
This article explored the thermal behavior of epoxy nanocomposites containing different types of nanofillers, such as 1-D Multiwall Carbon Nanotubes (MWCNTs) and 2-D predominant shape of Exfoliated Graphite nanoparticles (EG). The thermal conductivity measurements were conducted using a thermal constants analyzer which is based on the transient plane source (TPS) technique. The measurements indicated that better heat conduction is found in epoxy systems loaded with 2-D predominant shape of Exfoliated ...
Compared to traditional epoxy, polybenzoxazine resins have improved thermal, mechanical, and electrical properties. In this article, spherical aluminum nitride (AIN) was studied as a filler in bisphenol A-aniline-based polybenzoxazine (poly(BA-a)). Thermal conductivity was obtained by transient plane source method. Thermal conductivity of each composite gradually increased with enhanced filler amount. Poly(BA-a)/AIN composites also had higher thermal conductivity than systems containing epoxy/AIN....
Thermally conductive polymers are the most effective and economic methods of removing heat accumulation from microelectronics. In the present study, m-xylylenediamine (MPDA) was used as a curing agent for the epoxy matrix and analyzed for its effect on the thermal conductivity of the composite. Thermal conductivity was measured with a thermal analyzer using the transient plane source (TPS) method. When filling content of the multiwall carbon nanotubes (MWNTs) was 2%wt, ...
